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Unsolved Onboard Matrix Glitcher Solder Bridge Points

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finalman

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So I'm doing a RGH1 jasper and want to know what the six onboard solder points are for. Outlined in a red square in the following picture.



My glitch chip looks like this but has the crystal oscillator.

Previously I had a CR3 Lite installed that was initially giving insta-boots but then began taking minutes to glitch or not at all. Changing wires and wire positioning didn't help so I changed over to the Matrix chip but I'm not getting any glitch LED pulses. Matrix chip is programmed for Jasper RGH1.

Do I need to bridge any of the matrix chip six solder points together?

Does it matter that the crystal oscillator is still in place on FAT 360s, will that stop it from glitching?

Also I think I read somewhere to solder a 68pf cap between cpu-rst and gnd.

UPDATE: Got it glitching but is the same instability as the CR3 Lite. Turns out the pinout A-F lettering is different between TX coolrunner and matrix chips.
 
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afterjo

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all depends on what RGH you want to make, rgh 1.0, rgh 1.2, rgh 2.0, etc.

just follow tutorial for your desired RGH type. RGH 1.2 is recommended.
 
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